Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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*Performance range | *Performance range | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range | ||
|style="background:LightGrey; color:black"|RF powers | |style="background:LightGrey; color:black"|RF powers | ||
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|style="background:LightGrey; color:black"|Gas flows | |style="background:LightGrey; color:black"|Gas flows | ||
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* SF | * SF<sub>6</sub>: 0 to 1200 sccm | ||
* O<sub>2</sub>: 0 to 200 sccm | |||
* C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm | |||
* Ar: 0 to 283 sccm | |||
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|style="background:LightGrey; color:black"|Pressure and temperature | |||
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* Pressure range 4 to 250 mTorr | |||
* Temperature range -20 to 30 degrees C | |||
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|style="background:LightGrey; color:black"|Multiplexing | |||
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* Bosch processes | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||