Specific Process Knowledge/Thermal Process/Furnace APOX: Difference between revisions

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 ==Overview of the performance of Apox furnace and some process related parameters==
-{| border="2" cellspacing="0" cellpadding="10"
+{| border="2" cellspacing="0" cellpadding="0"
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-!style="background:silver; color:black;" align="left"|Purpose
+!style="background:silver; color:black;" align="center"|Purpose
 |style="background:LightGrey; color:black"|Oxidation and annealing
 |style="background:WhiteSmoke; color:black"|Oxidation:
 *Wet: with bubbler (water steam + N<sub>2</sub>)
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-!style="background:silver; color:black" align="left"|Performance
+!style="background:silver; color:black" align="center"|Performance
 |style="background:LightGrey; color:black"|Film thickness
 |style="background:WhiteSmoke; color:black"|
 *Wet SiO<sub>2</sub>: used for layer thickness >5µm
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-!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
 |style="background:LightGrey; color:black"|Process Temperature
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 *N<sub>2</sub>:? sccm
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-!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|