Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions

Revision as of 14:39, 26 November 2012

C4 Furnace Aluminium Anneal

C4 Furnace Anneal is a Tempress horizontal furnace for annealing of silicon wafers with Aluminium.

This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the cross contamination chart. If you are in doubt, please send a mail to furnace@danchip.dtu.dk.

The user manual(s), technical information and contact information can be found in LabManager:

Aluminium Anneal (C4)

Process knowledge

Annealing: look at the Annealing page

Overview of the performance of Aluminium Anneal furnace and some process related parameters

Purpose	Annealing	Annealing of wafers containing aluminium.
Performance	Film thickness
Process parameter range	Process Temperature	400-500 ^oC
	Process pressure	1 atm
	Gas flows	N₂: 5 sccm O₂: 5 sccm
Substrates	Batch size	1-30 4" wafer (or 2" wafers)
Substrates	Substrate material allowed	Silicon wafers with alluminium. Wafers are allowed after alluminium lift off or after alluminium etch and resiststrip in acetone

@@ Line 4: / Line 4: @@
 C4 Furnace Anneal is a Tempress horizontal furnace for annealing of silicon wafers with Aluminium.
-This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. The furnaces are the cleanest process chambers in the cleanroom. In this furnace it is allowed to enter wafers that contains aluminium. Check the cross contamination chart. If you are in doubt, please ask one from the furnace team.
+This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 cross contamination chart]. If you are in doubt, please send a mail to [mailto:furnace@danchip.dtu.dk furnace@danchip.dtu.dk].
+'''The user manual(s), technical information and contact information can be found in LabManager:'''
+'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=90 Aluminium Anneal (C4)]'''
 ==Process knowledge==
 *Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing|Annealing]] page
-<br clear="all" />
 ==Overview of the performance of Aluminium Anneal furnace and some process related parameters==
-{| border="2" cellspacing="0" cellpadding="10"
+{| border="2" cellspacing="0" cellpadding="0"
 |-
-!style="background:silver; color:black;" align="left"|Purpose
+!style="background:silver; color:black;" align="center"|Purpose
 |style="background:LightGrey; color:black"|Annealing
 |style="background:WhiteSmoke; color:black"|Annealing of wafers containing aluminium.
 |-
-!style="background:silver; color:black" align="left"|Performance
+!style="background:silver; color:black" align="center"|Performance
 |style="background:LightGrey; color:black"|Film thickness
 |style="background:WhiteSmoke; color:black"|
 |-
-!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
 |style="background:LightGrey; color:black"|Process Temperature
 |style="background:WhiteSmoke; color:black"|
@@ Line 33: / Line 37: @@
 |style="background:LightGrey; color:black"|Gas flows
 |style="background:WhiteSmoke; color:black"|
-*N<sub>2</sub>
+*N<sub>2</sub>: 5 sccm
+*O<sub>2</sub>: 5 sccm
 |-
-!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|