Specific Process Knowledge/Thermal Process/A1 Bor Drive-in furnace: Difference between revisions

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'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&page_id=47 Bor Drive-in]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=47 Bor Drive-in]'''


==Process knowledge==
==Process knowledge==

Revision as of 13:20, 26 November 2012

A1 Furnace Boron drive-in

A1 Boron drive in furnace: positioned in cleanroom 2

A1 Furnace boron drive-in is a Tempress horizontal furnace for oxidation of silicon wafers, annealing of the grown oxide, drive-in of boron after a predeposition, oxidation of the boron phase layer. Boron predeposition takes place in the A2 Furnace boron pre-dep. It can also be used for drive in of boron which has been ion implanted.

A1 is the top furnace tube in the A-stack positioned in cleanroom 2. The A-stack together with furnace C2 are the cleanest of all our furnaces. Please be aware of which substrates are allowed to enter this furnace. Check the cross contamination chart. If you are in doubt, please send a mail to the Furnace group.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Bor Drive-in

Process knowledge


Overview of the performance of the boron drive-in furnace and some process related parameters

Purpose Drive-in of boron, oxidation of silicon and boron phase layer and annealing of the oxide Oxidation:
  • Dry
  • Wet: with torch (H2+O2)
Performance Film thickness
  • Dry SiO2: 50 Å to ~2000 Å (takes too long to make it thicker)
  • Wet SiO2: 50 Å to ~3 µm (takes too long to make it thicker)
Process parameter range Process Temperature
  • 800-1150 oC
Process pressure
  • 1 atm
Gasses on the system
  • O2, H2 and N2
Substrates Batch size
  • 1-30 4" wafer (or 2" wafers) per run
Substrate material allowed