Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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== The DRIE Pegasus at Danchip == | |||
[[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]] | [[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]] | ||
The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description|here]] for more fundamental information of the system. | |||
The user manual, quality control procedure and the results may all be found on the [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| DRIE/Pegasus LabManager] page. | |||
In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information | |||
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Waferloading|here]]. | |||
= Important: New rules (as of August 2011) for using the Pegasus = | = Important: New rules (as of August 2011) for using the Pegasus = | ||
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==The Bosch process in the DRIE-Pegasus== | ==The Bosch process in the DRIE-Pegasus== | ||
This section introduces the advanced Bosch process used at the Pegasus and the process options it offers. | This section introduces the advanced Bosch process used at the Pegasus and the process options it offers. | ||