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Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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|H<sub>2</sub>O, NH<sub>4</sub>OH(25-29%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|H<sub>2</sub>O, NH<sub>4</sub>OH(25-29%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|H<sub>2</sub>O, HCl(37%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|H<sub>2</sub>O, HCl(37%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|5% H2
|5% HF
|-
|-
|'''Process temperature'''
|'''Process temperature'''
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