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Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet).
The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet).
It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by H<math>_2</math>O<math>_2</math>. Therefore the life time of the RCA solutions are limited by the presence of the H<math>_2</math>O<math>_2</math> which is highly volatile at 70 <sup>o</sup>C.
It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by H<sub>2</sub>O<sub>2</sub>. Therefore the life time of the RCA solutions are limited by the presence of the H<sub>2</sub>O<sub>2</sub> which is highly volatile at 70 <sup>o</sup>C.


*The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metals. <br \>
*The RCA1 contains: H<sub>2</sub>O, NH<sub>4</sub>OH and H<sub>2</sub>O<sub>2<sub> (5:1:1). It is used for removal of light organics, particles and metals. <br \>
*The RCA2 contains: H<math>_2</math>O, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals.
*The RCA2 contains: H<sub>2</sub>O, HCl and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals.


===RCA procedure===
===RCA procedure===
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|-
|-
|'''Chemical solution'''
|'''Chemical solution'''
|H<math>_2</math>O, NH<math>_4</math>OH(25-29%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1)
|H<sub>2</sub>O, NH<sub>4</sub>OH(25-29%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|H<math>_2</math>O, HCl(37%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1)
|H<sub>2</sub>O, HCl(37%) and H<sub>2</sub>O<sub>2</sub>(30%) (5:1:1)
|5% HF
|5% H2
|-
|-
|'''Process temperature'''
|'''Process temperature'''
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