Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

Revision as of 12:42, 20 November 2007

Topographic measurements are measurements were you can measure hight differences on your substrate. If you measure in many spots of you substrate you can get a topographic image of your substrate.

AT DANCHIP we have three systems for topographic measurement:

Tencor - Profiler for measuring micro structures
Dektak - Profiler for measuring micro structures
Nanoman - AFM for measuring nano structures

	Tencor	Dektak	Nanoman
General description	Profiler for measuring micro structures	Profiler for measuring micro structures. Can do wafer mapping	AFM for measuring nanostructures and surface roughness
Substrate size	4" or less		6" or less
Max. scan range xy	Line scan x: Full substrate size	Line scan x: Full substrate size	90 µm square
Max. scan range z			1 µm (can go up to 5 µm under special settings)
Resolution xy
Resolution z
Min. feature size
Max. aspect ratio			~1 with standard cantilever.
Tip radius			<12 nm on standard cantilever

@@ Line 13: / Line 13: @@
 |-
 |General description
+|Profiler for measuring micro structures
+|Profiler for measuring micro structures. Can do wafer mapping
+|AFM for measuring nanostructures and surface roughness
+|-
+|Substrate size
+|4" or less
 |
-|
+|6" or less
-|
 |-
 |Max. scan range xy
-|
+|Line scan x: Full substrate size
-|
+|Line scan x: Full substrate size
-|
+|90 µm square
 |-
 |Max. scan range z
 |
 |
-|
+|1 µm (can go up to 5 µm under special settings)
 |-
 |Resolution xy
@@ Line 44: / Line 49: @@
 |Max. aspect ratio
 |
+|
+|~1 with standard cantilever.
+|-
+|Tip radius
 |
 |
+|<12 nm on standard cantilever
 |-
 |}