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Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions

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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*SF<math>_6</math>: 0-130 sccm
*SF<math>_6</math>: 0-130 sccm
*O<math>_2</math>: 0-100 sccm
*O<sub>2</sub>: 0-100 sccm
*CHF<math>_3</math>: 0-100 sccm
*CHF<sub>3</sub>: 0-100 sccm
*CF<math>_4</math>: 0-84 sccm
*CF<sub>4</sub>: 0-84 sccm
*H<math>_2</math>: ?sccm
*H<sub>2</sub>: ?sccm
*Ar: 0-145 sccm
*Ar: 0-145 sccm
*N<math>_2</math>: 0-100 sccm
*N<sub>2</sub>: 0-100 sccm
*C<math>_2</math>F<math>_6</math>: 0-24 sccm
*C<sub>2</sub>F<sub>6</sub>: 0-24 sccm
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
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