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Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions

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==When the deposition is on one side of the wafer==
==When the deposition is on one side of the wafer==
#Measure the wafer bow on one of the profilometers (Dektak XTA_new or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.
#Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.
#Deposite the thin film
#Deposite the thin film
#Measure the wafer bow again:  
#Measure the wafer bow again:  
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==When the deposition is on both sides of the wafer==
==When the deposition is on both sides of the wafer==
#Deposite the thin film
#Deposite the thin film
#Pre-measurement: Measure the wafer bow on one of the profilometers (Dektak XTA_new or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.  
#Pre-measurement: Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.  
#Remove the thin film from one side of the wafer. If it is a single side polished wafer, remove it on the non-polished side.
#Remove the thin film from one side of the wafer. If it is a single side polished wafer, remove it on the non-polished side.
#Measure the wafer bow again:  
#Measure the wafer bow again: