Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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==When the deposition is on both sides of the wafer== | ==When the deposition is on both sides of the wafer== | ||
#Deposite the thin film | #Deposite the thin film | ||
#Pre-measurement: Measure the wafer bow on one of the profilometers ( | #Pre-measurement: Measure the wafer bow on one of the profilometers (Dektak XTA_new or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | ||
#Remove the thin film from one side of the wafer. If it is a single side polished wafer, remove it on the non-polished side. | #Remove the thin film from one side of the wafer. If it is a single side polished wafer, remove it on the non-polished side. | ||
#Measure the wafer bow again: | #Measure the wafer bow again: | ||