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==Dektak XTA_new stylus profiler==
The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range.
A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow.
===A rough overview of the performance of Dektak XTA_new===
[[image:Dektak XTA new.JPG|275x275px|right|thumb|Dektak XTA_new: positioned in Hymite room (characterization room).]]
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|Profiler for measuring micro structures.||style="background:WhiteSmoke; color:black"|
*Single point profiles
*Wafer mapping
*Stress measurements by measuring wafer bow
*Surface roughness on a line scan
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
Line scan x: 50 µm to 55 mm in a single scan, up to 200 mm with stiching
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Scan range z
|style="background:WhiteSmoke; color:black"|
50 Å to 1 mm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution xy
|style="background:WhiteSmoke; color:black"|
down to 0.003 µm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution z
|style="background:WhiteSmoke; color:black"|
1Å, 10Å, 40Å or 160Å (for ranges 65kÅ, 655 kÅ, 2620 kÅ and 1mm respectively)
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
*5 µm 45<sup>o</sup> cone
|-
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*up to 6"
|-
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*In principle all materials
|-
|}
==Dektak 8 stylus profiler==
==Dektak 8 stylus profiler==


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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*up to more than 6"
*up to more than 6"
|-
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*In principle all materials
|-
|}
==Dektak XTA_new stylus profiler==
The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range.
A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow.
===A rough overview of the performance of Dektak XTA_new===
[[image:Dektak XTA new.JPG|275x275px|right|thumb|Dektak XTA_new: positioned in Hymite room (characterization room).]]
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|Profiler for measuring micro structures.||style="background:WhiteSmoke; color:black"|
*Single point profiles
*Wafer mapping
*Stress measurements by measuring wafer bow
*Surface roughness on a line scan
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
Line scan x: 50 µm to 55 mm in a single scan, up to 200 mm with stiching
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Scan range z
|style="background:WhiteSmoke; color:black"|
50 Å to 1 mm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution xy
|style="background:WhiteSmoke; color:black"|
down to 0.003 µm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution z
|style="background:WhiteSmoke; color:black"|
1Å, 10Å, 40Å or 160Å (for ranges 65kÅ, 655 kÅ, 2620 kÅ and 1mm respectively)
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
*5 µm 45<sup>o</sup> cone
|-
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*up to 6"
|-
|-
|style="background:silver; color:black"|
|style="background:silver; color:black"|