Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range. | The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range. | ||
A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow. | A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow. | ||
===A rough overview of the performance of Dektak XTA_new=== | |||
UNDER CONSTRUCTION: | |||
{| border="2" cellspacing="0" cellpadding="10" | |||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Profiler for measuring micro structures.||style="background:WhiteSmoke; color:black"| | |||
*Single point profiles | |||
*Wafer mapping | |||
*Stress measurements by measuring wafer bow | |||
*Surface roughness on a line scan | |||
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!style="background:silver; color:black" align="left"|Performance | |||
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"| | |||
Line scan x: 50 µm to 100 mm | |||
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|style="background:silver; color:black"| | |||
|style="background:LightGrey; color:black"|Scan range z | |||
|style="background:WhiteSmoke; color:black"| | |||
50 Å to 1 mm | |||
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|style="background:silver; color:black"| | |||
|style="background:LightGrey; color:black"|Resolution xy | |||
|style="background:WhiteSmoke; color:black"| | |||
down to 0.067 µm | |||
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|style="background:silver; color:black"| | |||
|style="background:LightGrey; color:black"|Resolution z | |||
|style="background:WhiteSmoke; color:black"| | |||
1Å, 10Å, 40Å or 160Å (for ranges 65kÅ, 655 kÅ, 2620 kÅ and 1mm respectively) | |||
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|style="background:silver; color:black"| | |||
|style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W | |||
|style="background:WhiteSmoke; color:black"| | |||
1.2(W[µm]-5µm) | |||
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!style="background:silver; color:black" align="left"|Hardware settings | |||
|style="background:LightGrey; color:black"|Tip radius | |||
|style="background:WhiteSmoke; color:black"| | |||
*5 µm 45<sup>o</sup> cone | |||
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!style="background:silver; color:black" align="left"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black"| | |||
*up to 8" | |||
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|style="background:silver; color:black"| | |||
| style="background:LightGrey; color:black"|Substrate material allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*In principle all materials | |||
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|} | |||
==Comparing the profilers== | ==Comparing the profilers== | ||
Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page. | Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page. | ||