Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with Alcatel'' | [[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with Alcatel'' | ||
== Cu sputtering in ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])== | |||
Process parameters are listed here: [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|Cu sputter in PVD co-sputter/evaporation]] | |||