Specific Process Knowledge/Thin film deposition/Deposition of Copper

Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	Sputter deposition (PVD co-sputter/evaporation)
Batch size	Up to 1x4" wafers smaller pieces	4x6" wafers or 4x4" wafers or 4x2" wafers
Pre-clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 0.5µm	10Å to 0.5µm
Deposition rate	2Å/s to 15Å/s	Depending on process paraneters

Studies of Cu deposition processes

Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel