Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions

Revision as of 14:12, 1 October 2012

Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	Sputter deposition (PVD co-sputter/evaporation)
Batch size	Up to 1x4" wafers smaller pieces	4x6" wafers or 4x4" wafers or 4x2" wafers
Pre-clean	RF Ar clean		RF Ar clean
Layer thickness	10Å to 0.5µm	10Å to 0.5µm
Deposition rate	2Å/s to 15Å/s	Depending on process paraneters

Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel

@@ Line 20: / Line 20: @@
 |RF Ar clean
 |
-..
+|RF Ar clean
 |-
@@ Line 26: / Line 26: @@
 |10Å to 0.5µm
 |
-..
+Å to 0.5µm
 |-
@@ Line 32: / Line 32: @@
 |2Å/s to 15Å/s
 |
-..
+Depending on process paraneters
 |-
 |}