Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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|RF Ar clean | |RF Ar clean | ||
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|RF Ar clean | |||
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|10Å to 0.5µm | |10Å to 0.5µm | ||
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. | 10Å to 0.5µm | ||
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
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Depending on process paraneters | |||
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