Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch: Difference between revisions
| Line 35: | Line 35: | ||
|5 | |5 | ||
|- | |- | ||
|Helium backside cooling [Torr]|37.5 | |Helium backside cooling [Torr] | ||
|37.5 | |||
|- | |- | ||
|} | |} | ||
| Line 35: | Line 35: | ||
|5 | |5 | ||
|- | |- | ||
|Helium backside cooling [Torr]|37.5 | |Helium backside cooling [Torr] | ||
|37.5 | |||
|- | |- | ||
|} | |} | ||