Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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! Thermal evaporation (Wordentec) | ! Thermal evaporation (Wordentec) | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
Revision as of 09:38, 20 November 2007
Aluminium can be deposited by e-beam evaporation, by sputter and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | Thermal evaporation (Wordentec) | |
|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1500 Å | 10Å to 1 µm | 10Å to ~0.5µm (very time consuming ) | 10Å to 0.5 µm (this uses all Al in the boat) |
| Deposition rate | 2Å/s to 15Å/s | ||||
| Thickness uniformity | |||||
| Roughness |