Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
| Line 177: | Line 177: | ||
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!C<sub>4</sub>F<sub>8</sub> (sccm) | !C<sub>4</sub>F<sub>8</sub> (sccm) | ||
| | | 50 | ||
| | | 50 | ||
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!SF<sub>6</sub> (sccm) | !SF<sub>6</sub> (sccm) | ||
| | | 50 | ||
| | | 0 | ||
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| Line 201: | Line 201: | ||
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!O<sub>2</sub> (sccm) | !O<sub>2</sub> (sccm) | ||
| | | 5 | ||
| | | 0 | ||
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| Line 213: | Line 213: | ||
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! Coil power (W) | ! Coil power (W) | ||
| | | 350 | ||
| | | 500 | ||
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| Line 225: | Line 225: | ||
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!Platen power (W) | !Platen power (W) | ||
| | | 30 | ||
| | | 0 | ||
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| Line 237: | Line 237: | ||
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! Pressure (mtorr) | ! Pressure (mtorr) | ||
| | | 10 | ||
| | | 10 | ||
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| Line 249: | Line 249: | ||
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! Temperature (degs C) | ! Temperature (degs C) | ||
| colspan="2" align="center"| | | colspan="2" align="center"| 20 | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
|- | |- | ||
! Duration (cycles/time) | ! Duration (cycles/time) | ||
| colspan="2" align="center"| | | colspan="2" align="center"| 5 | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
|- | |- | ||
! colspan=" | ! colspan="11" align="center"| Etch rates (nm/min) | ||
|- | |- | ||
| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||. | ||
Revision as of 08:21, 17 September 2012
Development of continuous nanoetch
| Recipe | nano1.0 | nano1.1 | nano1.2 | nano1.3 | nano1.21 | nano1.4 | nano1.41 | nano1.42 | nano1.43 |
|---|---|---|---|---|---|---|---|---|---|
| C4F8 (sccm) | 52 | 52 | 52 | 52 | 75 | 75 | 75 | 75 | 75 |
| SF6 (sccm) | 38 | 38 | 38 | 38 | 38 | 38 | 38 | 38 | 38 |
| O2 (sccm) | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Coil power (W) | 800 (F) | 600 (F) | 800 (F) | 600 (F) | 800 (F) | 800 (F) | 800 (F) | 800 (F) | 800 (F) |
| Platen power (W) | 50 | 50 | 50 | 40 | 50 | 50 | 75 | 40 | 30 |
| Pressure (mtorr) | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Temperature (degs C) | 10 | 10 | -10 | -10 | -10 | -20 | -20 | -20 | -20 |
| Process time (s) | 120 | 120 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| Etch rates (nm/min) | |||||||||
| Averages | 295 | 228 | 299 | 235 | 183 | 183 | 166 | 160 | 148 |
| Std. Dev | 36 | 29 | 37 | 20 | 9 | 9 | 9 | 8 | 6 |
| Zep etch rate (nm/min) | |||||||||
| 172 | 95 | 94 | 69 | 67 | 101 | 65 | 55 | ||
| Sidewall angle (degrees) | |||||||||
| Averages | 93 | 94 | 92 | 94 | 91 | 91 | 90 | 90 | 90 |
| Std. Dev | 1 | 1 | 0 | 1 | 0 | 0 | 1 | 0 | 0 |
| CD loss (nm pr edge) | |||||||||
| Averages | -11 | -13 | -17 | -10 | -10 | -10 | -20 | -13 | -24 |
| Std. Dev | 12 | 10 | 11 | 14 | 15 | 15 | 16 | 15 | 21 |
| Bowing (nm) | |||||||||
| Averages | 31 | 42 | 13 | 16 | 6 | 6 | 3 | -3 | 0 |
| Std. Dev | 7 | 6 | 4 | 3 | 2 | 2 | 2 | 3 | 1 |
| Bottom curvature | |||||||||
| Averages | -45 | -45 | -44 | -43 | -32 | -32 | -34 | -32 | -39 |
| Std. Dev | 5 | 7 | 4 | 9 | 10 | 10 | 9 | 8 | 9 |
| Images | Images | Images | Images | Images | Images | Images | Images | Images | Images |
Development of switched nanoetch process
On the basis of the pxnano2 recipe from the ASE we will try to make a similar Bosch process on the Pegasus. The substrates are 6" wafers with
| Recipe | Nanobosch1 | Nanobosch2 | Nanobosch3 | Nanobosch4 | Nanobosch5 | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| Cycle | Etch | Dep | Etch | Dep | Etch | Dep | Etch | Dep | Etch | Dep |
| C4F8 (sccm) | 50 | 50 | ||||||||
| SF6 (sccm) | 50 | 0 | ||||||||
| O2 (sccm) | 5 | 0 | ||||||||
| Coil power (W) | 350 | 500 | ||||||||
| Platen power (W) | 30 | 0 | ||||||||
| Pressure (mtorr) | 10 | 10 | ||||||||
| Temperature (degs C) | 20 | |||||||||
| Duration (cycles/time) | 5 | |||||||||
| Etch rates (nm/min) | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Std. Dev | . | . | . | . | . | . | . | . | . | |
| Zep etch rate (nm/min) | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Sidewall angle (degrees) | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Std. Dev | . | . | . | . | . | . | . | . | . | |
| CD loss (nm pr edge) | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Std. Dev | . | . | . | . | . | . | . | . | . | |
| Bowing (nm) | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Std. Dev | . | . | . | . | . | . | . | . | . | |
| Bottom curvature | ||||||||||
| Averages | . | . | . | . | . | . | . | . | . | |
| Std. Dev | . | . | . | . | . | . | . | . | . | |
| Images | Images | Images | Images | Images | Images | Images | Images | Images | Images | |