Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

@@ Line 75: / Line 75: @@
 |One wafer at a time
 |One wafer at a time
+|-
+|Allowed materials
+|
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Other materials (only in "Fumehood KOH")
+|
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
+|
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
+*E-beam resist
+*Aluminium
+*Chromium (ONLY RIE2!)
+*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!)
+|
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
+*E-beam resist
+*Aluminium
 |-
 |}