Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions
| Line 34: | Line 34: | ||
*Aluminium | *Aluminium | ||
*Chromium (ONLY RIE2!) | *Chromium (ONLY RIE2!) | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | |||
|- | |- | ||
|Etch rate | |Etch rate | ||
| Line 74: | Line 75: | ||
*Blue film | *Blue film | ||
| | | | ||
*Silicon | |||
*Silicon Oxide | |||
*Silicon Nitride | |||
*Silicon Oxynitride | |||
*Photoresist | |||
*E-beam resist | |||
*Aluminium | |||
*Chromium (ONLY RIE2!) | |||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | |||
|- | |- | ||
|} | |} | ||