Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
No edit summary |
No edit summary |
||
| Line 33: | Line 33: | ||
|- | |- | ||
| Rate | | Rate | ||
| About 0, | | About 0,7 Å/s | ||
| About 0, | | About 0,6 Å/s | ||
|- | |- | ||
|} | |} | ||
Revision as of 15:07, 15 August 2012
Silicon sputter
Silicon can be deposited in Wordentec.
Parameters
Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.
Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces.
| Settings 1 | Settings 2 | |
|---|---|---|
| Process type | Sputtering | Sputtering |
| Power | 130W | 170W |
| Sputter pressure | 5*10-3 | 1*10-2 |
| Rate | About 0,7 Å/s | About 0,6 Å/s |