Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
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{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
! | ! | ||
! | ! Settings 1 | ||
! Settings 2 | |||
|- | |- | ||
| Process type | | Process type | ||
|Sputtering | |Sputtering | ||
|Sputtering | |||
|- | |- | ||
| Power | | Power | ||
|130W | |130W | ||
|170W | |||
|- | |- | ||
| Sputter pressure | | Sputter pressure | ||
| 5*10<sup>-2</sup> | | 5*10<sup>-2</sup> | ||
| 5*10<sup>-2</sup> | |||
|- | |- | ||
| Rate | | Rate | ||
| About 0,6Å/s | |||
| About 0,6Å/s | | About 0,6Å/s | ||
|- | |- | ||
|} | |} | ||