Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
New page: == Silicon sputter== Silicon can be deposited in Wordentec. '''Parameters''' Listed below are tried parameters, that can ... |
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Listed below are tried parameters, that can be used during deposition. | Listed below are tried parameters, that can be used during deposition. | ||
Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces. | |||
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Revision as of 13:11, 15 August 2012
Silicon sputter
Silicon can be deposited in Wordentec.
Parameters
Listed below are tried parameters, that can be used during deposition.
Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces.
| Setting | |
|---|---|
| Process type | Sputtering |
| Power | 1000W |
| Base pressure | 6*10-7 |
| Ignition pressure | 6*10-3 |
| Sputter pressure | 4*10-3 |
| Rate | About 0,14Å/s (2 wafers plates, rotating) |