Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test: Difference between revisions
New page: =Results from the Optical Profiler (Sensofar) acceptance test= The acceptance test was performed in January 2012 by STInstruments and Sensofar together with Pernille V. Larsen @ Danchip ... |
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The acceptance test was performed in January 2012 by STInstruments and Sensofar together with | The acceptance test was performed in January 2012 by STInstruments and Sensofar together with | ||
Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip. | Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip. | ||
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| align="center" style="background:#f0f0f0;"|'''''' | |||
| align="center" style="background:#f0f0f0;"|'''Title''' | |||
| align="center" style="background:#f0f0f0;"|'''Sample description / measurement''' | |||
| align="center" style="background:#f0f0f0;"|'''Acceptance criteria''' | |||
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| 1||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm | |||
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| ||||Trench depth with aspect ratio 1:10 on a 10 µm wide trench|| | |||
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| 2||Patterned flat sample of silicon.||Sample material: Patterned silicon substrate.||Depth 91±2 µm | |||
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| ||||Trench depth with aspect ratio 1:11 on a 8 µm wide trench|| | |||
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| 3||Patterned flat sample of silicon||Sample material: Patterned silicon substrate||Depth 85±2 µm | |||
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| ||||Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench|| | |||
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| 4||Patterned flat sample of glass||3D profile of pattern etched down in a quartz sample.||Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1% | |||
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| ||||Pattern size 20 µm x 20 µm, depth 500 nm|| | |||
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| 5||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement. | |||
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| ||||7 µm deep pattern, trench width 6 µm|| | |||
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| 6||Flat sample of silicon with thick layer of patterned polymer||Sample material: SU8 on silicon. ||Height 69±2 µm | |||
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| ||||Pillar heights of 69 µm with 25 µm between pillar edges|| | |||
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| 7||Free standing structure||Measure bow due to stress of a membrane.||Membrane bow repeatability of 5 successive measurement within 2% | |||
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| ||||Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm).|| | |||
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| ||||Membrane size: honey comb structure approximately 150 µm in diameter.|| | |||
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| ||||Bow < 500 nm|| | |||
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| 8||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2% | |||
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| 9||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm | |||
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| ||||2.5 µm wide trench in silicon with a depth of 20 µm|| | |||
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| 10||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm | |||
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| 11||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement. | |||
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| 12||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement. | |||
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| ||||Measure thickness of AZ-resist on pillars of 50 µm in diameter|| | |||
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| 13||Roughness repeatability||Sample material: Si wafer with poly-silicon layer.||Repeatability within 0.2% | |||
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| ||||3 successive measurements of the roughness || | |||
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Revision as of 09:13, 3 August 2012
Results from the Optical Profiler (Sensofar) acceptance test
The acceptance test was performed in January 2012 by STInstruments and Sensofar together with Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.
' | Title | Sample description / measurement | Acceptance criteria |
1 | Patterned flat sample of silicon | Sample material: Patterned silicon substrate. | Depth 100±2 µm |
Trench depth with aspect ratio 1:10 on a 10 µm wide trench | |||
2 | Patterned flat sample of silicon. | Sample material: Patterned silicon substrate. | Depth 91±2 µm |
Trench depth with aspect ratio 1:11 on a 8 µm wide trench | |||
3 | Patterned flat sample of silicon | Sample material: Patterned silicon substrate | Depth 85±2 µm |
Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench | |||
4 | Patterned flat sample of glass | 3D profile of pattern etched down in a quartz sample. | Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1% |
Pattern size 20 µm x 20 µm, depth 500 nm | |||
5 | Flat sample of silicon with thick patterned oxide | Step height of patterned thick (10 µm) oxide on top of a silicon wafer. | Step height must be within ±3% of a SEM profile measurement. |
7 µm deep pattern, trench width 6 µm | |||
6 | Flat sample of silicon with thick layer of patterned polymer | Sample material: SU8 on silicon. | Height 69±2 µm |
Pillar heights of 69 µm with 25 µm between pillar edges | |||
7 | Free standing structure | Measure bow due to stress of a membrane. | Membrane bow repeatability of 5 successive measurement within 2% |
Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm). | |||
Membrane size: honey comb structure approximately 150 µm in diameter. | |||
Bow < 500 nm | |||
8 | Stitching of large area | Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes. | Membrane bow must the same as on 7 within 2% |
9 | Narrow trenches and holes | Sample material: Patterned silicon substrate. | Depth 20±2 µm |
2.5 µm wide trench in silicon with a depth of 20 µm | |||
10 | Film thickness measurement of transparent thin film | Transparent thin film thickness of 28 nm SiO2 on Si | SiO2 thickness 28±1 nm |
11 | Measurements of multiple stacks | 120 nm nitride on 110 nm oxide on a silicon substrate | Within ±2% on each layer from an ellipsometer measurement. |
12 | Film thickness measurements of transparent films on small structure | Sample material: Si with 1.5 µm patterned AZ-resist | Within ±1% from a standard profiler measurement. |
Measure thickness of AZ-resist on pillars of 50 µm in diameter | |||
13 | Roughness repeatability | Sample material: Si wafer with poly-silicon layer. | Repeatability within 0.2% |
3 successive measurements of the roughness | |||