Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE process trends: Difference between revisions

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New page: =Some general process trends= This page is supposed to gather some general process trends and good advise for designing IBE recipes. ==Etch rate== {| border="2" cellspacing="2" cellpaddin...
 
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|-
|-
|increases with
|increases with
|Beam current
|Beam current
|-
|-
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|Beam current * Beam voltage
|Beam current * Beam voltage
|-
|-
|Not significantly effected by
|not significantly effected by
|Stage angle
|Stage angle
|-
|-
|Not significantly effected by
|not significantly effected by
|Accelerator voltage
|Accelerator voltage
|-
|-
|}
|}
==Etch profile==
{| border="2" cellspacing="2" cellpadding="3"
!Etch profile (goal 90dg)
!Parameters
|-
|improves with
|Low stage angle (optimum around 5-10 dg)
|-
|is effected by
|Beam current (low I(B)(400mA) better than high I(B)(600mA))
|-
|is effected by
|Accelerator voltage * Stage angle
|-
|not significantly effected by
|Beam voltage
|-

Revision as of 10:47, 31 July 2012

Some general process trends

This page is supposed to gather some general process trends and good advise for designing IBE recipes.

Etch rate

Etch rate Parameters
increases with Beam current
increases with Beam voltage
increases with Beam current * Beam voltage
not significantly effected by Stage angle
not significantly effected by Accelerator voltage

Etch profile

Etch profile (goal 90dg) Parameters
improves with Low stage angle (optimum around 5-10 dg)
is effected by Beam current (low I(B)(400mA) better than high I(B)(600mA))
is effected by Accelerator voltage * Stage angle
not significantly effected by Beam voltage