Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
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{| border="2" cellspacing="1" cellpadding="3" style="text-align:center;" | {| border="2" cellspacing="1" cellpadding="3" style="text-align:center;" | ||
!Recipe | !Recipe | ||
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!C<sub>4</sub>F<sub>8</sub> (sccm) | !C<sub>4</sub>F<sub>8</sub> (sccm) | ||
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!SF<sub>6</sub> (sccm) | !SF<sub>6</sub> (sccm) | ||
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!O<sub>2</sub> (sccm) | !O<sub>2</sub> (sccm) | ||
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! Coil power (W) | ! Coil power (W) | ||
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!Platen power (W) | !Platen power (W) | ||
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! Pressure (mtorr) | ! Pressure (mtorr) | ||
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! Temperature (degs C) | ! Temperature (degs C) | ||
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! Process time (s) | ! Process time (s) | ||
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! colspan="10" align="center"| Etch rates (nm/min) | ! colspan="10" align="center"| Etch rates (nm/min) | ||