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Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

BGE (talk | contribs)
BGE (talk | contribs)
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|'''Max. scan range xy'''
|'''Max. scan range xy'''
|Line scan x: 50µm to 200mm  
|Line scan x: 50µm to 200mm  
|Depending on objective:
|Depending on the objective:
*One view: 127µmX95µm to 1270µmX955µm
*One view: 127µmX95µm to 1270µmX955µm
*Stitching: In principel a hole 6" wafer (time consuming)
*Stitching: In principel a hole 6" wafer (time consuming)
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|'''Max. scan range z'''
|'''Max. scan range z'''
|50Å to 262µm  
|50Å to 262µm  
|Depending on objective and Z resolution:
|Depending on the objective and Z resolution:
*94.4µm ->9984µm
*94.4µm ->9984µm
|1 µm (can go up to 5 µm under special settings)
|1 µm (can go up to 5 µm under special settings)
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|'''Resolution xy'''
|'''Resolution xy'''
|down to 0.067 µm
|down to 0.067 µm
|Depending on objective:
|Depending on the objective:
*0.5µm -> 5µm
*0.5µm -> 5µm
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
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|- valign="top"
|- valign="top"
|'''Max. scan depth [µm] (as a function of trench width W''')
|'''Max. scan depth [µm] (as a function of trench width W''')
|1.2(W[µm]-5µm)
|1.2*(W[µm]-5µm)
|Depending on materila and trench width:
|Depending on material and trench width:
*Somewhere between 1:1 and 1:12
*Somewhere between 1:1 and 1:12
|~1 with standard cantilever.
|~1:1 with standard cantilever.
|-valign="top"
|-valign="top"
|'''Tip radius'''
|'''Tip radius'''