Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions
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|'''Max. scan range xy''' | |'''Max. scan range xy''' | ||
|Line scan x: 50µm to 200mm | |Line scan x: 50µm to 200mm | ||
|Depending on objective: | |Depending on the objective: | ||
*One view: 127µmX95µm to 1270µmX955µm | *One view: 127µmX95µm to 1270µmX955µm | ||
*Stitching: In principel a hole 6" wafer (time consuming) | *Stitching: In principel a hole 6" wafer (time consuming) | ||
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|'''Max. scan range z''' | |'''Max. scan range z''' | ||
|50Å to 262µm | |50Å to 262µm | ||
|Depending on objective and Z resolution: | |Depending on the objective and Z resolution: | ||
*94.4µm ->9984µm | *94.4µm ->9984µm | ||
|1 µm (can go up to 5 µm under special settings) | |1 µm (can go up to 5 µm under special settings) | ||
| Line 42: | Line 42: | ||
|'''Resolution xy''' | |'''Resolution xy''' | ||
|down to 0.067 µm | |down to 0.067 µm | ||
|Depending on objective: | |Depending on the objective: | ||
*0.5µm -> 5µm | *0.5µm -> 5µm | ||
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2% | |Depending on scan size and number of samples per line and number of lines - accuracy better than 2% | ||
| Line 55: | Line 55: | ||
|- valign="top" | |- valign="top" | ||
|'''Max. scan depth [µm] (as a function of trench width W''') | |'''Max. scan depth [µm] (as a function of trench width W''') | ||
|1.2(W[µm]-5µm) | |1.2*(W[µm]-5µm) | ||
|Depending on | |Depending on material and trench width: | ||
*Somewhere between 1:1 and 1:12 | *Somewhere between 1:1 and 1:12 | ||
|~1 with standard cantilever. | |~1:1 with standard cantilever. | ||
|-valign="top" | |-valign="top" | ||
|'''Tip radius''' | |'''Tip radius''' | ||