Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
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*[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | *[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2|Nanoetch contest: DRIE-Pegasus versus ASE (nano1.42 versus pxnano2)]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2|Nanoetch contest: DRIE-Pegasus versus ASE (nano1.42 versus pxnano2)]] | ||
{| border="2" cellspacing="1" cellpadding="3" style="text-align:center;" | |||
!Recipe | |||
!nano1.0 | |||
!nano1.1 | |||
!nano1.2 | |||
!nano1.3 | |||
!nano1.21 | |||
!nano1.4 | |||
!nano1.41 | |||
!nano1.42 | |||
!nano1.43 | |||
|- | |||
!C<sub>4</sub>F<sub>8</sub> (sccm) | |||
|52 | |||
|52 | |||
|52 | |||
|52 | |||
|75 | |||
|75 | |||
|75 | |||
|75 | |||
|75 | |||
|- | |||
!SF<sub>6</sub> (sccm) | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|38 | |||
|- | |||
!O<sub>2</sub> (sccm) | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|0 | |||
|- | |||
! Coil power (W) | |||
|800 (F) | |||
|600 (F) | |||
|800 (F) | |||
|600 (F) | |||
|800 (F) | |||
|800 (F) | |||
|800 (F) | |||
|800 (F) | |||
|800 (F) | |||
|- | |||
!Platen power (W) | |||
|50 | |||
|50 | |||
|50 | |||
|40 | |||
|50 | |||
|50 | |||
|75 | |||
|40 | |||
|30 | |||
|- | |||
! Pressure (mtorr) | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|4 | |||
|- | |||
! Temperature (degs C) | |||
| 10 | |||
| 10 | |||
| -10 | |||
| -10 | |||
| -10 | |||
| -20 | |||
| -20 | |||
| -20 | |||
| -20 | |||
|- | |||
! Process time (s) | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|120 | |||
|- | |||
! colspan="10" align="center"| Etch rates (nm/min) | |||
|- | |||
| Averages||.||.||.||.||.||.||.||.||. | |||
|- | |||
| Std. Dev||.||.||.||.||.||.||.||.||. | |||
|- | |||
! colspan="10" align="center"| Zep etch rate (nm/min) | |||
|- | |||
| || ||.||.||.||.||.||.||.||.||. | |||
|- | |||
! colspan="10" align="center"| Sidewall angle (degrees) | |||
|- | |||
| Averages||.||.||.||.||.||.||.||.||. | |||
|- | |||
| Std. Dev||.||.||.||.||.||.||.||.||. | |||
|- | |||
! colspan="10" align="center"| CD loss (nm pr edge) | |||
|- | |||
| Averages||.||.||.||.||.||.||.||||. | |||
|- | |||
| Std. Dev||.||.||.||.||.||.||.||.|| | |||
|- | |||
! colspan="10" align="center"| Bowing (nm) | |||
|- | |||
| Averages||.||.||.||.||.||.||.||.|| | |||
|- | |||
| Std. Dev||.||.||.||.||.||.||||.||. | |||
|- | |||
! colspan="10" align="center"| Bottom curvature | |||
|- | |||
| Averages||.||.||.||.||.||.||.||.||. | |||
|- | |||
| Std. Dev||.||.||.||.||.||.||.||.||. | |||
|- | |||
! Images | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano11|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano12|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano13|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano121|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano14|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano141|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano143|Images]] | |||
|- | |||
|} | |||