Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions

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*[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]]
*[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2|Nanoetch contest: DRIE-Pegasus versus ASE (nano1.42 versus pxnano2)]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2|Nanoetch contest: DRIE-Pegasus versus ASE (nano1.42 versus pxnano2)]]
{| border="2" cellspacing="1" cellpadding="3" style="text-align:center;"
!Recipe
!nano1.0
!nano1.1
!nano1.2
!nano1.3
!nano1.21
!nano1.4
!nano1.41
!nano1.42
!nano1.43
|-
!C<sub>4</sub>F<sub>8</sub> (sccm)
|52
|52
|52
|52
|75
|75
|75
|75
|75
|-
!SF<sub>6</sub> (sccm)
|38
|38
|38
|38
|38
|38
|38
|38
|38
|-
!O<sub>2</sub> (sccm)
|0
|0
|0
|0
|0
|0
|0
|0
|0
|-
! Coil power (W)
|800 (F)
|600 (F)
|800 (F)
|600 (F)
|800 (F)
|800 (F)
|800 (F)
|800 (F)
|800 (F)
|-
!Platen power (W)
|50
|50
|50
|40
|50
|50
|75
|40
|30
|-
! Pressure (mtorr)
|4
|4
|4
|4
|4
|4
|4
|4
|4
|-
! Temperature (degs C)
| 10
| 10
| -10
| -10
| -10
| -20
| -20
| -20
| -20
|-
! Process time (s)
|120
|120
|120
|120
|120
|120
|120
|120
|120
|-
! colspan="10" align="center"| Etch rates (nm/min)
|-
| Averages||.||.||.||.||.||.||.||.||.
|-
| Std. Dev||.||.||.||.||.||.||.||.||.
|-
! colspan="10" align="center"| Zep etch rate (nm/min)
|-
| || ||.||.||.||.||.||.||.||.||.
|-
! colspan="10" align="center"| Sidewall angle (degrees)
|-
| Averages||.||.||.||.||.||.||.||.||.
|-
| Std. Dev||.||.||.||.||.||.||.||.||.
|-
! colspan="10" align="center"| CD loss (nm pr edge)
|-
| Averages||.||.||.||.||.||.||.||||.
|-
| Std. Dev||.||.||.||.||.||.||.||.||
|-
! colspan="10" align="center"| Bowing (nm)
|-
| Averages||.||.||.||.||.||.||.||.||
|-
| Std. Dev||.||.||.||.||.||.||||.||.
|-
! colspan="10" align="center"| Bottom curvature
|-
| Averages||.||.||.||.||.||.||.||.||.
|-
| Std. Dev||.||.||.||.||.||.||.||.||.
|-
! Images
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano11|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano12|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano13|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano121|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano14|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano141|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142|Images]]
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano143|Images]]
|-
|}

Revision as of 13:45, 18 June 2012

Recipe nano1.0 nano1.1 nano1.2 nano1.3 nano1.21 nano1.4 nano1.41 nano1.42 nano1.43
C4F8 (sccm) 52 52 52 52 75 75 75 75 75
SF6 (sccm) 38 38 38 38 38 38 38 38 38
O2 (sccm) 0 0 0 0 0 0 0 0 0
Coil power (W) 800 (F) 600 (F) 800 (F) 600 (F) 800 (F) 800 (F) 800 (F) 800 (F) 800 (F)
Platen power (W) 50 50 50 40 50 50 75 40 30
Pressure (mtorr) 4 4 4 4 4 4 4 4 4
Temperature (degs C) 10 10 -10 -10 -10 -20 -20 -20 -20
Process time (s) 120 120 120 120 120 120 120 120 120
Etch rates (nm/min)
Averages 295 228 299 235 183 183 166 160 148
Std. Dev 36 29 37 20 9 9 9 8 6
Zep etch rate (nm/min)
172 95 94 69 67 101 65 55
Sidewall angle (degrees)
Averages 93 94 92 94 91 91 90 90 90
Std. Dev 1 1 0 1 0 0 1 0 0
CD loss (nm pr edge)
Averages -11 -13 -17 -10 -10 -10 -20 -13 -24
Std. Dev 12 10 11 14 15 15 16 15 21
Bowing (nm)
Averages 31 42 13 16 6 6 3 -3 0
Std. Dev 7 6 4 3 2 2 2 3 1
Bottom curvature
Averages -45 -45 -44 -43 -32 -32 -34 -32 -39
Std. Dev 5 7 4 9 10 10 9 8 9
Images Images Images Images Images Images Images Images Images Images









Recipe nano1.0 nano1.1 nano1.2 nano1.3 nano1.21 nano1.4 nano1.41 nano1.42 nano1.43
C4F8 (sccm) 52 52 52 52 75 75 75 75 75
SF6 (sccm) 38 38 38 38 38 38 38 38 38
O2 (sccm) 0 0 0 0 0 0 0 0 0
Coil power (W) 800 (F) 600 (F) 800 (F) 600 (F) 800 (F) 800 (F) 800 (F) 800 (F) 800 (F)
Platen power (W) 50 50 50 40 50 50 75 40 30
Pressure (mtorr) 4 4 4 4 4 4 4 4 4
Temperature (degs C) 10 10 -10 -10 -10 -20 -20 -20 -20
Process time (s) 120 120 120 120 120 120 120 120 120
Etch rates (nm/min)
Averages . . . . . . . . .
Std. Dev . . . . . . . . .
Zep etch rate (nm/min)
. . . . . . . . .
Sidewall angle (degrees)
Averages . . . . . . . . .
Std. Dev . . . . . . . . .
CD loss (nm pr edge)
Averages . . . . . . . .
Std. Dev . . . . . . . .
Bowing (nm)
Averages . . . . . . . .
Std. Dev . . . . . . . .
Bottom curvature
Averages . . . . . . . . .
Std. Dev . . . . . . . . .
Images Images Images Images Images Images Images Images Images Images
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