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Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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Bureaucrats, danchip, Administrators
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BGE (talk | contribs)
Bureaucrats, danchip, Administrators
2,908 edits
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!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"|
*standard microscope imaging
*3D imaging of surface
*confocal imaging
*Roughness measurements
*confocal profiling
*Step height measurement
*PSI (Phase Shift Interferometry)
*3D topographic measurements
*VSI (Vertical Scanning Interferometry)
*Thin film thickness measurement in small spots (down to 4µm)
*high resolution thin film thickness measurement  
*Wafer mapping
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!style="background:silver; color:black;" align="left"|Posibilities  
!style="background:silver; color:black;" align="left"|Posibilities  
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*PSI (Phase Shift Interferometry)
*PSI (Phase Shift Interferometry)
*VSI (Vertical Scanning Interferometry)
*VSI (Vertical Scanning Interferometry)
*high resolution thin film thickness measurement  
*high resolution thin film thickness measurement using reflectrometry
*Wafer mapping
*wafer mapping
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!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left"|Performance
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