Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"| | ||
*standard microscope imaging | |||
*confocal imaging | |||
*confocal profiling | |||
*PSI (Phase Shift Interferometry) | |||
*VSI (Vertical Scanning Interferometry) | |||
*high resolution thin film thickness measurement | |||
*Wafer mapping | |||
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!style="background:silver; color:black;" align="left"|Posibilities | |||
|style="background:LightGrey; color:black"|Confocal and interferometric profiling and reflectometry||style="background:WhiteSmoke; color:black"| | |||
*standard microscope imaging | *standard microscope imaging | ||
*confocal imaging | *confocal imaging | ||