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Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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The main purpose is 3D topographic imaging of surfaces, Step height measurements in smaller trenches/holes than can be obtained with standard stylus method, roughness measurements with larger FOV than the AFM, but less horisontal resolution.
The main purpose is 3D topographic imaging of surfaces, Step height measurements in smaller trenches/holes than can be obtained with standard stylus method, roughness measurements with larger FOV than the AFM, but less horisontal resolution.
===A rough overview of the performance of the Optical Profiler (Sensofar)===
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"|
*standard microscope imaging
*confocal imaging
*confocal profiling
*PSI (Phase Shift Interferometry)
*VSI (Vertical Scanning Interferometry)
*high resolution thin film thickness measurement
*Wafer mapping
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
Line scan x: 50 µm to 100 mm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Scan range z
|style="background:WhiteSmoke; color:black"|
50 Å to 1 mm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution xy
|style="background:WhiteSmoke; color:black"|
down to 0.067 µm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution z
|style="background:WhiteSmoke; color:black"|
1Å, 10Å, 40Å or 160Å (for ranges 65kÅ, 655 kÅ, 2620 kÅ and 1mm respectively)
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
*5 µm 45<sup>o</sup> cone
|-
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*up to 8"
|-
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*In principle all materials
|-
|}


==Comparing the profilers==
==Comparing the profilers==
Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page.
Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page.