Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
| Line 33: | Line 33: | ||
*(Poly)Silicon | *(Poly)Silicon | ||
*Aluminium | *Aluminium | ||
*Other metals that covers less the 5% of the wafer area (ONLY RIE2!) | *Other metals that covers less the 5% of the wafer area (ONLY RIE2!) | ||
| | | | ||
| Line 39: | Line 38: | ||
*(Poly)Silicon | *(Poly)Silicon | ||
*Aluminium | *Aluminium | ||
*Chromium | |||
|- valign="top" | |- valign="top" | ||
|'''Etch rate''' | |'''Etch rate''' | ||