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Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions

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*Isotropic etch
*Isotropic etch
*Good for removing all nitride on a wafer surface without a mask
*Well suited for removing all nitride on a wafer surface (nitride strip) without a mask. High selctivity Si3N4/Si (>100) and Si3N4/SiO2 (>20) @ 180 C.
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*Anisotropic etch: vertical sidewalls
*Anisotropic etch: vertical sidewalls
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