Specific Process Knowledge/Characterization/XPS: Difference between revisions
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Revision as of 14:10, 17 October 2011
XPS
See more about elemental analysis on the side Element analysis
A rough overview of XPS-ThermoScientific characteristics
| Purpose | Chemical analysis |
|
|---|---|---|
| Performance | Spot size | Can be set between 30µm - 400µm |
| Probing depth | Depending on probed element. Max probe depth lies within 10-200 Å. | |
| Resolution | Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected. | |
| Charge compensation |
Flood gun can be used for charge compensation of non conductive samples | |
| Finding structures | Choose measuring spot from camera image (magnified) | |
| Depth profiling | Purpose | With ion beam etch the top layer of the material can be removed, to do a depth profiling |
| Ion beam size | About 0,3x1 mm | |
| Substrates | Substrate size |
Max 60x60 mm |
| Substrate thickness |
Max height about 20 mm |