Specific Process Knowledge/Characterization/XPS: Difference between revisions
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XPS-ThermoScientific | ===A rough overview of XPS-ThermoScientific characteristics=== | ||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Chemical analysis | |||
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* Probing elemental composition | |||
* Chemical state identification | |||
* Non destructive technique | |||
* Surface sensitive | |||
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!style="background:silver; color:black" align="left"|Performance | |||
|style="background:LightGrey; color:black"|Spot size | |||
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm | |||
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|style="background:LightGrey; color:black"|Probing depth | |||
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å. | |||
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|style="background:LightGrey; color:black"|Resolution | |||
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µm | |||
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|style="background:LightGrey; color:black"|Charge compensation | |||
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1Å, ) | |||
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|style="background:LightGrey; color:black"|. | |||
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µm | |||
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!style="background:silver; color:black" align="left"|Depth profiling | |||
|style="background:LightGrey; color:black"|uu | |||
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*5 | |||
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!style="background:silver; color:black" align="left"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
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*up | |||
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| style="background:LightGrey; color:black"|Substrate thickness | |||
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*hh | |||
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