Specific Process Knowledge/Characterization/XPS: Difference between revisions

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XPS-ThermoScientific
===A rough overview of XPS-ThermoScientific characteristics===
 
{| border="2" cellspacing="0" cellpadding="20" |-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|Chemical analysis
|style="background:WhiteSmoke; color:black"|
* Probing elemental composition
* Chemical state identification
* Non destructive technique
* Surface sensitive
 
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Spot size
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Probing depth
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å.
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Resolution
|style="background:WhiteSmoke; color:black"|
 
µm
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Charge compensation
|style="background:WhiteSmoke; color:black"|
1Å,  )
|-
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|. 
|style="background:WhiteSmoke; color:black"|
µm
|-
|-
!style="background:silver; color:black" align="left"|Depth profiling
|style="background:LightGrey; color:black"|uu
|style="background:WhiteSmoke; color:black"|
*5
|-
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*up
|-
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Substrate thickness
|style="background:WhiteSmoke; color:black"|
*hh
|-
|}

Revision as of 13:45, 17 October 2011

XPS

See more about elemental analysis on the side Element analysis


A rough overview of XPS-ThermoScientific characteristics

Purpose Chemical analysis
  • Probing elemental composition
  • Chemical state identification
  • Non destructive technique
  • Surface sensitive
Performance Spot size Can be set between 30µm - 400µm
Probing depth Depending on probed element. Max probe depth lies within 10-200 Å.
Resolution
µm
Charge compensation

1Å, )

.

µm

Depth profiling uu
  • 5
Substrates Substrate size
  • up
Substrate thickness
  • hh