Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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Process D is labelled ''Micro stamp etch''. | Process D is labelled ''Micro stamp etch''. | ||
In the acceptance test the process was run on a | In the acceptance test the process was run on a 100 mm wafer with 50 % etch load. | ||
[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D: Recipe, specifications and results]] | [[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D: Recipe, specifications and results]] | ||
=== SOI etch === | === SOI etch === | ||