Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | |||
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*4x4" wafers or | *4x4" wafers or | ||
*2x2" wafers | *2x2" wafers | ||
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*6x6" wafers or | |||
*6x4" wafers or | |||
*24x2" wafers | |||
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| Pre-clean | | Pre-clean | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
| Line 32: | Line 37: | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|10Å to 1000Å | |10Å to 1000Å | ||
|10Å to about 2000Å | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
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|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
|About 1Å/s | |About 1Å/s | ||
|Depending on process paramterers (see logbook) | |||
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