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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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*Coating and baking of  
*Coating and baking of  
**AR-P 6200 (CSAR)
**AR-P 6200 (CSAR)
**ZEP 520A diluted 1:2 (pay-per-use)
**AZ 5214E
**AZ 5214E
**AZ MiR 701 (29cps)
**AZ MiR 701 (29cps)
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* PGMEA solvent for edge bead removal and backside rinse
* PGMEA solvent for edge bead removal and backside rinse
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* AR-P 6200.09 (CSAR) for 2", 4", and 6"
* AR-P 6200.09 (CSAR) for 4", and 6"
* AZ5214E for 2", 4", and 6"
* ZEP 520A diluted 1:2 for 4", and 6"
* AZ5214E for 4", and 6"
* AZ MiR 701 (29cps) for 4", and 6"
* AZ MiR 701 (29cps) for 4", and 6"
* AZ4562 for 4", and 6"
* AZ4562 for 4", and 6"
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* No manual dispense
* No manual dispense
* Syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)
* Syringe dispense (30cc) of PGMEA and anisole-based resist (Coater1 only)
| Only manual dispense
| Only manual dispense
|colspan="2"| Only manual dispense
|colspan="2"| Only manual dispense
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*200 mm wafers (may require tool change)
*200 mm wafers (may require tool change)
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*2" or 50 mm wafers
*2" or 50 mm wafers (tool change required)
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
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