Jump to content

Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions

← Older editNewer edit →
VisualWikitext
Cchvi (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
416 edits
Cchvi (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
416 edits
No edit summary
Line 54: Line 54:
==3D printing==
==3D printing==


'''Punching'''[[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]]
==Cutting PDMS==


==Cutting PDMS==
[[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]]
 
'''Punching'''


[[File:PDMS through-hole methods.jpg|800px|thumb|center|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]]
[[File:PDMS through-hole methods.jpg|1000px|thumb|center|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]]


'''Laser ablation'''
'''Laser ablation'''
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/PDMS_Microfluidic"