Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
| Line 51: | Line 51: | ||
==Cutting PDMS== | ==Cutting PDMS== | ||
'''Punching''' | '''Punching'''[[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut ondovodual chips out of a PDMS microfluidic wafer]] | ||
'''Laser ablation''' | '''Laser ablation''' | ||