Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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'''This page is under construction''' | '''This page is under construction''' | ||
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk | |||
'''Contents''' | |||
1. Material requirements | |||
2. Process flow | |||
3. Mixing PDMS resin and degassing | |||
4. Soft lithography micro molding | |||
4.1 Mold surface conditioning | |||
4.2 Molding by pouring | |||
4.3 Molding by spin coating. | |||
4.4 Baking – Curing | |||
4.5 Alignment – Demolding | |||
5. 3D printing | |||
6. Cutting PDMS | |||
6.1 Punching | |||
6.2 Laser ablation | |||
6.3 Machining/milling | |||
6.4 Air/water jet machining | |||
7. Bonding | |||
7.1 PDMS/PDMS and PDMS/glass bonding | |||
7.2 PDMS/PMMA bonding | |||
8. References | |||
Revision as of 14:04, 16 July 2026
This page is under construction
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk
Contents
1. Material requirements
2. Process flow
3. Mixing PDMS resin and degassing
4. Soft lithography micro molding
4.1 Mold surface conditioning
4.2 Molding by pouring
4.3 Molding by spin coating.
4.4 Baking – Curing
4.5 Alignment – Demolding
5. 3D printing
6. Cutting PDMS
6.1 Punching
6.2 Laser ablation
6.3 Machining/milling
6.4 Air/water jet machining
7. Bonding
7.1 PDMS/PDMS and PDMS/glass bonding
7.2 PDMS/PMMA bonding
8. References