Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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'''This page is under construction''' | |||
I. Material requirements | |||
II. Typical process flow | |||
III. Surface conditioning | |||
IV. Mixing – degassing | |||
V. Molding | |||
VI. Spin coating | |||
VII. Baking – Curing | |||
VIII. Alignment – Demolding | |||
IX. Punching access ports/througholes | |||
X. 3D printing | |||
XI. Laser ablation | |||
XII. Machining/milling | |||
XIII. Air/water jet machining | |||
XIV. Bonding | |||
PDMS/PDMS and PDMS/glass bonding | |||
PDMS/PMMA bonding | |||
References. | |||
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk | |||
Revision as of 13:52, 16 July 2026
This page is under construction
I. Material requirements
II. Typical process flow
III. Surface conditioning
IV. Mixing – degassing
V. Molding
VI. Spin coating
VII. Baking – Curing
VIII. Alignment – Demolding
IX. Punching access ports/througholes
X. 3D printing
XI. Laser ablation
XII. Machining/milling
XIII. Air/water jet machining
XIV. Bonding
PDMS/PDMS and PDMS/glass bonding
PDMS/PMMA bonding
References.
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk