Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions
Appearance
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! Parameter | ! Parameter | ||
|'''Cr etch''' | |||
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! Cl<sub>2</sub> (sccm) | ! Cl<sub>2</sub> (sccm) | ||
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| ~0.9 | | ~0.9 | ||
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!Comment | |||
|This recipe is under development due to a high aspect ratio dependent etch rate for very narrow trenceds <100nm | |||
|} | |} | ||
=== Etching of nanostructures in silicon === | === Etching of nanostructures in silicon === | ||