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Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch): Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,326 edits
 
Line 87: Line 87:
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 6" wafer per run (only when the system is setup to 6")
*1 4" wafer per run
*1 4" wafer per run
*1 2" wafer per run (needs carrier)
*1 2" wafer per run (needs carrier)
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