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Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions

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==Wet etching of Chromium==
==Wet etching of Chromium==
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.]]
[[File:Si etch 3.png|300x300px |thumb| Work space in Fume Hood 06 in cleanroom D-3 can be used for wet chromium etching - workspace should be booked.]]
Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. Make sure no other setup is present in the fume hood before you start. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].


We use the following solution to etch chromium:
We use the following solution to etch chromium:


# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]
# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login to kemibrug) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]


The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
'''Etch in Fume hood'''
Wet etching of chromium in fume hood at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably fume hood 6 for Si etch 3 in D-3
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=4748&mach=368&chpr=0 here].


PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured)
PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured)


Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste.  
Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste.
 
'''Etching of Chromium in Acid 1 wetbench 11'''
[[File:Wetbench 11.png|300x300px|thumb|Acid 1 Wetbench 11 in cleanroom D-3 can be used for wet chromium etching of 6" and 8" wafers, after agreement with wetchemistry group.]]
 
Always make an agreement with Wetchemistry group before training
 
The bath is for 6" and 8" wafers.
 
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 here].


===Overview of the chromium etch process===
===Overview of the chromium etch process===