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Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Mbec (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
202 edits
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
! Chromium etch 1
! Chromium etch in Fume hood
! Chromium etch Acid 1 wetbench 11
|-  
|-  


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|
|
Etch of chromium
Etch of chromium
|
Etch of Chromium 6" and 8" wafers 
|-
|-


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!Link to safety APV and KBA
!Link to safety APV and KBA
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].  
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|[https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 see Wetbench 11 APV/manual here].
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|-
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Chemical solution
!Chemical solution
|Chrome Etch 18
|Chrome Etch 18
|Chrome Etch 18
|-
|-
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!Process temperature
!Process temperature
|Room temperature
|Room temperature
 
|Room temperature
|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Possible masking materials
!Possible masking materials
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|-
|-
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Etch rate
!Etch rate
|~ 150 nm/min at 22°C
|~ 150 nm/min at 22°C
|~ 150 nm/min at 22°C
|-
|-
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!Batch size
!Batch size
|1-7 4" wafers at a time
|1-7 4" wafers at a time
|Up to 5 6" or 8" wafers at a time
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Size of substrate
!Size of substrate
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
|6" and 8" 
|-
|-


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|No restrictions.  
|No restrictions.  
Make a note on the beaker of which materials have been processed.
Make a note on the beaker of which materials have been processed.
|
See the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=580 Cross Contamination Sheet] for Acid 1
|-
|-
|}
|}
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