Specific Process Knowledge/Lithography/Aligners/MAvsMLA: Difference between revisions
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**100mm Si, SSP <100> | **100mm Si, SSP <100> | ||
*Resist | *Resist | ||
**AZ 5214E (image reversal, but processed positive) | **[[Specific_Process_Knowledge/Lithography/5214E|AZ 5214E]] (image reversal, but processed positive) | ||
**AZ MiR 701 (positive) | **[[Specific_Process_Knowledge/Lithography/MiR|AZ MiR 701]] (positive) | ||
**AZ nLOF 2020 (negative) | **[[Specific_Process_Knowledge/Lithography/nLOF|AZ nLOF 2020]] (negative) | ||
*Spin coating (incl. HMDS) | *Spin coating (incl. HMDS) | ||
**Spin | **[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]] | ||
*Exposure | *Exposure | ||
**Aligner: MA6-2 | **[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]] | ||
**Aligner: MA6-1 (in PolyFabLab) | **[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]] (in PolyFabLab) | ||
**Aligner: Maskless 02 | **[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]] | ||
**Aligner: Maskless 01 | **[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]] | ||
*Development (incl. PEB, if relevant) | *Development (incl. PEB, if relevant) | ||
**Developer: TMAH UV-lithography | **[[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]] | ||
*Inspection | *Inspection | ||
**Microscope Olympus MX63 | **[[Specific_Process_Knowledge/Characterization/Optical_microscope|Microscope Olympus MX63]] | ||
**SEM Supra 1 | **[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | ||
**SEM Supra 3 | **[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | ||
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