Specific Process Knowledge/Lithography/Aligners/MAvsMLA: Difference between revisions
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Mask design used in the investigation: [[Media:LithoTestAlign 2025 v10.gds|LithoTestAlign_2025_v10.gds]] | Mask design used in the investigation: [[Media:LithoTestAlign 2025 v10.gds|LithoTestAlign_2025_v10.gds]] | ||
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=Tools used in the investigation= | |||
*Wafers | |||
**100mm Si, SSP <100> | |||
*Resist | |||
**AZ 5214E (image reversal, but processed positive) | |||
**AZ MiR 701 (positive) | |||
**AZ nLOF 2020 (negative) | |||
*Spin coating (incl. HMDS) | |||
**Spin Caoter: Gamma UV | |||
*Exposure | |||
**Aligner: MA6-2 | |||
**Aligner: MA6-1 (in PolyFabLab) | |||
**Aligner: Maskless 02 (MLA2) | |||
**Aligner: Maskless 01 (MLA1) | |||
*Development (incl. PEB, if relevant) | |||
**Developer: TMAH UV-lithography | |||
*Inspection | |||
**Microscope Olympus MX63 | |||
**SEM Supra 1 | |||
**SEM Supra 3 | |||
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=Data from the investigation= | =Data from the investigation= | ||