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Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

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!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
|-  
|-  
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*Up to 1x4" wafers
*Up to 1x4" wafers
*smaller pieces
*smaller pieces
|
*8x4" wafers or
*5x6" wafers
|
|
*6x6" wafers or
*6x6" wafers or
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| Pre-clean
| Pre-clean
|RF Ar clean
|RF Ar clean
|Ar ion bombartment
|RF Ar clean  
|RF Ar clean  
|-
|-
| Layer thickness
| Layer thickness
|10Å to 1µm  
|10Å to 1µm  
|10Å to 0.5µm
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 0.5µm (0.5µm not on all wafers)
|-
|-
| Deposition rate
| Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|1Å/s to 5Å/s
|1Å to 10 Å/s
|1Å to 10 Å/s
|-
|-
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